DocumentCode :
404835
Title :
A new dual-bandgap SiC-on-Si p-emitter, SiGe n-base, lateral Schottky metal-collector (PNM) HBT on SOI with reduced collector-emitter offset voltage
Author :
Kumar, M. Jagadesh ; Reddy, C. Linga
Author_Institution :
Dept. of Electr. Eng., Indian Inst. of Technol., New Delhi, India
Volume :
1
fYear :
2003
fDate :
15-17 Oct. 2003
Firstpage :
493
Abstract :
We introduce a novel approach, called dual bandgap SiC-on-Si emitter, to reduce the collector emitter offset voltage in the case of wide bandgap SiC-emitter PNP HBTs. In our approach, the collector-emitter offset-voltage is reduced significantly by partially eliminating the built-in potential difference between the emitter-base junction and collector-base junction. We have evaluated the performance of the proposed device in detail using 2D device simulation. The proposed dual bandgap SiC-on-Si P-emitter SiGe N-base lateral Schottky metal-collector (PNM) HBT is shown to exhibit a current gain close to that of the wide bandgap emitter (SiC) PNP HBT while its collector-emitter offset-voltage is significantly lower than that of the SiC PNP HBT. The transient response of the proposed structure is also much superior due to its Schottky collector.
Keywords :
Ge-Si alloys; Schottky barriers; elemental semiconductors; heterojunction bipolar transistors; semiconductor device models; semiconductor materials; silicon; silicon compounds; silicon-on-insulator; transient response; wide band gap semiconductors; PNM HBT; SOI; SiC-Si-SiGe-SiO2; collector-base junction; collector-emitter offset voltage reduction; dual-bandgap p-emitter n-base HBT; emitter-base junction; lateral Schottky metal-collector HBT; transient response; wide bandgap PNP HBT; Germanium silicon alloys; Heterojunction bipolar transistors; Intelligent control; Military satellites; Photonic band gap; Silicon carbide; Silicon germanium; Thermal conductivity; Transient response; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
TENCON 2003. Conference on Convergent Technologies for the Asia-Pacific Region
Print_ISBN :
0-7803-8162-9
Type :
conf
DOI :
10.1109/TENCON.2003.1273371
Filename :
1273371
Link To Document :
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