Title :
Design and analysis of optical subassembly (OSA) used in high speed parallel transmission package
Author :
Lin, Samuel I-En ; Liu, Yang-Liang
Author_Institution :
Electr. Eng. Dept., Chung-Chou Inst. of Technol., Yuan-Lin, Taiwan
Abstract :
The major market trends for optical systems are pushing for low-cost packages that integrate two or more discrete device functions in a small footprint This paper experimentally shows the coupling efficiency of proposed structure used for high-speed parallel transmission. The 3D finite element modeling was used to investigate the mechanical stress performance and thermal analysis. The idealized ball lens-fiber coupling derivation is also included in this paper. The finite element results indicated the selection and mechanical strength of sapphire substrate are critical to the optical performance.
Keywords :
chip scale packaging; finite element analysis; high-speed optical techniques; integrated optics; lenses; optical fibres; packaging; sapphire; stress analysis; thermal analysis; 3D finite element modeling; Al2O3; ball lens-fiber coupling derivation; coupling efficiency; high speed parallel transmission package; integrated discrete device; low-cost packages; mechanical stress performance; optical subassembly design; optical systems; sapphire substrate; thermal analysis; Finite element methods; High speed optical techniques; Lenses; Optical coupling; Optical design; Optical fiber communication; Optical fiber devices; Packaging; Substrates; Vertical cavity surface emitting lasers;
Conference_Titel :
Lasers and Electro-Optics, 2003. CLEO/Pacific Rim 2003. The 5th Pacific Rim Conference on
Print_ISBN :
0-7803-7766-4
DOI :
10.1109/CLEOPR.2003.1274734
