DocumentCode
405603
Title
Dielectric reliability and material properties of Al2O3 in metal insulator metal capacitors (MIMCAP) for RF bipolar technologies in comparison to SiO2, SiN and Ta2O5
Author
Allers, K.-H. ; Brenner, P. ; Schrenk, M.
Author_Institution
Corporate Logic, Reliability Dept., Infineon Technol. AG, Munich, Germany
fYear
2003
fDate
28-30 Sept. 2003
Firstpage
35
Lastpage
38
Abstract
The intrinsic dielectric properties of Al2O3 have been investigated with respect to MIMCAP applications and compared to SiO2, SiN and Ta2O5. Al2O3 may be scaled down to 20nm (3.5fF/μm2) while still meeting the reliability requirements and thus surpassing SiN and SiO2 considerably. C(V) dependence (about 100ppm/V2 @ 50nm for the quadratic voltage coefficient) and dielectric loss (tanδ=0.0024) meet the requirements for analog and RF applications. Compared to Ta2O5, Al2O3 has much lower leakage, but a slight disadvantage in achievable specific capacitance.
Keywords
MIM devices; aluminium compounds; capacitors; dielectric properties; semiconductor device reliability; semiconductor device testing; silicon compounds; tantalum compounds; Al2O3; MIMCAP; RF application; RF bipolar technologies; SiN; SiO2; Ta2O5; analog application; dielectric loss; dielectric properties; dielectric reliability; material properties; metal insulator metal capacitors; Aluminum compounds; Capacitors; MIM devices; Semiconductor device reliability; Semiconductor device testing; Silicon compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Bipolar/BiCMOS Circuits and Technology Meeting, 2003. Proceedings of the
ISSN
1088-9299
Print_ISBN
0-7803-7800-8
Type
conf
DOI
10.1109/BIPOL.2003.1274930
Filename
1274930
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