DocumentCode :
406428
Title :
Novel temperature based technique for measurement of endothelial dysfunction
Author :
Kharalkar, Nachiket ; Valvano, Jonathan W. ; Naghavi, Morteza ; Wei, Chia Ling
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
Volume :
1
fYear :
2003
fDate :
17-21 Sept. 2003
Firstpage :
308
Abstract :
The endothelial cells, which form the inner lining of the arteries, respond to changes in pressure by producing nitric oxide (NO) which in turn causes vasodilation. The normal functioning of the endothelium is hampered in certain cardiovascular diseases. Various methods have been developed to non-invasively determine the endothelial dysfunction (EDF). We propose to measure the EDF by causing reactive hyperemia in the arm and measuring the temperature variations of the hand region. We created reactive hyperemia by occluding the arm by blood pressure cuff at about 200 mmHg for 5 minutes, and then suddenly released the pressure. Using a computer-based data acquisition system, the temperature variations of the distal palmer pad/middle finger, during the entire procedure were continuously monitored. Initial studies have indicated that there is significant increase in the rate of rise as compared to rate off all of temperature (mean increase = 117%, standard deviation = 50%). Our goal is to non-invasively predict EDF from the temperature technique.
Keywords :
biomedical measurement; blood vessels; cellular biophysics; diseases; haemodynamics; patient diagnosis; 200 mmHg; 5 min; arteries; blood pressure cuff; cardiovascular diseases; computer-based data acquisition system; endothelial cells; endothelial dysfunction; endothelium; reactive hyperemia; vasodilation; Arteries; Atherosclerosis; Blood flow; Blood pressure; Cardiac arrest; Cardiac disease; Cardiovascular system; Cells (biology); Temperature; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2003. Proceedings of the 25th Annual International Conference of the IEEE
ISSN :
1094-687X
Print_ISBN :
0-7803-7789-3
Type :
conf
DOI :
10.1109/IEMBS.2003.1279623
Filename :
1279623
Link To Document :
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