DocumentCode :
407299
Title :
Contribution to the dimensioning of the different insulating materials used in high voltage power electronics module manufacturing
Author :
Lebey, T. ; Malec, D. ; Bley, V. ; Breit, F. ; Dutarde, E.
Author_Institution :
Univ. Paul Sabatier, Toulouse, France
Volume :
1
fYear :
2003
fDate :
17-20 Nov. 2003
Firstpage :
55
Abstract :
In railways applications high voltage IGBT power modules are used to build power converters. Such an approach allows increasing at the same time the reliability, the thermal and electrical performances, to decrease the cost and to achieve an improved design. From a material point of view, such modules have to be considered as a stack of different types of materials. Among them, the dielectric materials, both organic and inorganic, suffer from a lack of knowledge of their properties. This paper describes the step by step method which has been followed to study different ceramic substrates and encapsulation materials in order to get a better understanding of their properties and their ability to be used in such a structure. Choice and dimensioning criteria will be presented.
Keywords :
ceramics; dielectric materials; encapsulation; insulated gate bipolar transistors; insulating materials; power bipolar transistors; silicones; substrates; ceramic substrates; dielectric materials; electrical performances; high voltage power electronics module manufacturing; inorganic materials; insulating materials; organic materials; power converters; railways applications; reliability; silicone gels; soft encapsulation materials; thermal performances; Ceramics; Costs; Dielectric materials; Insulated gate bipolar transistors; Insulation; Manufacturing; Multichip modules; Power electronics; Rail transportation; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics and Drive Systems, 2003. PEDS 2003. The Fifth International Conference on
Print_ISBN :
0-7803-7885-7
Type :
conf
DOI :
10.1109/PEDS.2003.1282678
Filename :
1282678
Link To Document :
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