Title :
Implementation of artificial neural networks on on-chip interconnects in VLSI circuits
Author :
Kumar, N. Suresh ; Kumar, M. Prem ; Anandh, T. Vijay ; Raju, Mrs S. ; Kumar, V. Abhai
Author_Institution :
Dept. of ECE, Mepco Schlenk Eng. Coll., Sivakasi, India
Abstract :
The advent of the VLSI circuits has brought down the size of the semiconductor devices considerably. As the size decreases the effects of reduced chip dimensions dominates the performance of the circuits. Consequently, the interconnection and packaging related issues are among the main factors that determine the number of circuits that can be integrated on a chip as well as the chip performance. The wiring capacitance and impedance, transmission line phenomenon, cross-talk between wires, simultaneous switching noise and clock skew are the factors that affect the performance of the circuits. The objective of this paper is to optimize on-chip interconnects for crosstalk and propagation delay using artificial neural networks.
Keywords :
VLSI; finite difference methods; integrated circuit interconnections; integrated circuit packaging; neural nets; VLSI circuits; artificial neural networks; chip dimensions; chip performance; clock skew; cross-talk; on-chip interconnects; packaging; propagation delay; semiconductor devices; simultaneous switching noise; transmission line phenomenon; wiring capacitance; Artificial neural networks; Capacitance; Crosstalk; Impedance; Integrated circuit interconnections; Network-on-a-chip; Semiconductor device packaging; Semiconductor devices; Very large scale integration; Wiring;
Conference_Titel :
Electromagnetic Interference and Compatibility, 2003. INCEMIC 2003. 8th International Conference on
Print_ISBN :
81-900652-1-1
DOI :
10.1109/ICEMIC.2003.1287760