DocumentCode :
408528
Title :
Formulation of different shapes of nanoparticles and their incorporation into polymers
Author :
Pothukuchi, Suresh ; Li, Yi ; Wong, C.P.
Author_Institution :
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2004
fDate :
2004
Firstpage :
200
Lastpage :
203
Abstract :
Shape controlling of nanoparticles is a very important aspect in nanotechnology. By controlling the particle sizes and shapes in the 1-100 nm range virtually all material properties can be controlled. The current work focuses on the synthesis of such nanoparticles and subsequent incorporation of the different shaped nanoparticles into epoxy matrix. The object of current interest is to evaluate the use of metal nanoparticles in polymer-metal composites. Of particular interest is the case where the first connected path of metal particles occurs across the sample, called the percolation threshold. There has been evidence of a giant increase in capacitance at room temperature just below the percolation threshold. The current work is an initial step to use the current developments in nanotechnology to incorporate various shaped fillers in polymer matrices. This can shed light on fundamental theory behind the dielectric properties of polymer-metal dielectrics. For the current work silver has been chosen as the metal and epoxy has been chosen as the polymer matrix. Nanocubes, spheres and wires have been synthesized by current and novel methods and incorporated into epoxy.
Keywords :
capacitance; filled polymers; nanocomposites; nanoparticles; nanotechnology; nanowires; particle size; percolation; capacitance; dielectric properties; epoxy matrix incorporation; metal nanoparticles; modified polyol process; nanocube synthesis; nanosphere synthesis; nanotechnology; nanowire synthesis; particle shape controlling; particle sizes; percolation threshold; polymer-metal composites; Capacitance; Dielectrics; Material properties; Nanoparticles; Nanotechnology; Polymers; Shape control; Silver; Size control; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2004. Proceedings. 9th International Symposium on
Print_ISBN :
0-7803-8436-9
Type :
conf
DOI :
10.1109/ISAPM.2004.1288013
Filename :
1288013
Link To Document :
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