• DocumentCode
    40986
  • Title

    Analysis of Excess Loss in SiFe Laminations Considering Eddy-Current Dominated Domain Wall Motion

  • Author

    Weimin Guan ; Haiyang Kong ; Miao Jin ; Lei Lan ; Zhiye Du ; Yadong Zhang ; Jiangjun Ruan ; Hailong Zhang

  • Author_Institution
    Sch. of Electr. Eng., Wuhan Univ., Wuhan, China
  • Volume
    51
  • Issue
    3
  • fYear
    2015
  • fDate
    Mar-15
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    To develop efficient silicon steel plates and electric machines using silicon steel laminations, the evaluation of excess loss in silicon steel plates is important. In this paper, investigation on excess loss calculation using the finite element method is carried out. The excess loss, which is mainly due to two factors, lack of flux penetration and domain wall pinning, is considered by the proposed approach using the domain wall bowing degree (DWBD), which depends on the above two factors. The DWBD is obtained using nonlinear eddy-current analysis. The correlation between the excess loss and the DWBD can be expressed as an exponential equation. Using the equation, the excess loss can be predicted under harmonic frequency in the range of 50-2000 Hz. These results can be applied to iron loss estimation, especially, when there are harmonics in the power supply.
  • Keywords
    eddy current losses; finite element analysis; laminations; magnetic domain walls; steel; DWBD; SiFe laminations; domain wall bowing degree; domain wall pinning; eddy-current dominated domain wall motion; electric machines; excess loss analysis; exponential equation; finite element method; frequency 50 Hz to 2000 Hz; harmonic frequency; iron loss estimation; nonlinear eddy-current analysis; power supply; silicon steel laminations; silicon steel plates; Iron; Magnetic domain walls; Magnetic domains; Magnetic flux; Magnetic hysteresis; Mathematical model; Steel; Domain wall motion; excess loss; numerical analysis; silicon steel plates;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/TMAG.2014.2362999
  • Filename
    7093477