Title :
On-board optical interconnection of 2.5Gb/s x 12 channels data using fiber-embedded PCB
Author :
Han Seo Cho ; Saekyoung Kang ; Mu Hee Cho ; Byung Sup Rho ; Hyo-Hoon Park ; Kyoung-up Shin ; Sang-Won Ha ; Byoung-Ho Rhee ; Dong-Su Kim ; Sun Tea Jung ; Taeil Kim
Author_Institution :
Optical Interconnection and Switching Laboratory, Information and Communications University
Abstract :
A simple method for fabricating fiber-embedded boards using a grooving technique for optical interconnects is described. It is quite cost effective and fully compatible with conventional PCB processes. On-board optical link of 2.5Gb/s signals between the transmitter and the receiver modules was demonstrated by placing connecting blocks having 45°-mirror planes at the ends of the fiber-embedded boards.
Keywords :
High speed optical techniques; Joining processes; Optical fibers; Optical interconnections; Optical polymers; Optical receivers; Optical surface waves; Optical transmitters; Optical waveguides; Vertical cavity surface emitting lasers; Optical printed-circuit board; VCSEL; electro-optical PCB; lamination; optical fiber; optical interconnection;
Conference_Titel :
Advanced Communication Technology, 2004. The 6th International Conference on
Conference_Location :
Phoenix Park, Korea
Print_ISBN :
89-5519-119-7
DOI :
10.1109/ICACT.2004.1292875
