Acoustical imaging evaluation of thin metal-metal adhesive bonds

Author

Maeva, E.Yu. ; Severina, I.A. ; Bugaev, A.S. ; Severin M ; Maev, R. Gr

Author_Institution

Windsor Univ., Ont., Canada

Volume

2

fYear

2003

fDate

5-8 Oct. 2003

Firstpage

2037

Abstract

The problem of developing reliable ultrasonic imaging method for characterization of the structural integrity of adhesive bonds in the joints of two thin metal sheets in automotive and aerospace industry is discussed. Mismatch of acoustical impedances and reverberation lead to appearance of long-time complex vibration. Significant attenuation in the adhesive layer also brings difficulties. A new approach, based on convolution filtering of the received signal is represented for the case of sound penetration through a three-layer structure. The experiments were performed with plane and spherically focused acoustic beams in pulse-echo mode in the frequency range of 3-15 MHz. Acoustical images of basic types of defects in real industrial samples are represented and discussed.

Keywords

acoustic convolution; adhesive bonding; aerospace industry; automobile industry; reverberation; structural acoustics; ultrasonic imaging; ultrasonic materials testing; 3 to 15 MHz; acoustic beams; acoustical imaging; acoustical impedance mismatch; aerospace industry; automotive industry; convolution filtering; pulse-echo mode; reverberation mismatch; sound penetration; thin metal-metal adhesive bonds; Acoustic imaging; Adhesives; Aerospace industry; Attenuation; Automotive engineering; Convolution; Filtering; Impedance; Reverberation; Ultrasonic imaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics, 2003 IEEE Symposium on

Print_ISBN

0-7803-7922-5

Type

conf

DOI

10.1109/ULTSYM.2003.1293318

Filename

1293318