Title :
High frequency complex vibration systems using a complex vibration converter with diagonal slits
Author :
Tsujino, Jiromaru ; Ihara, Shigeru ; Harada, Yoshiki ; Kasahara, Kohei ; Sakamaki, Yoshihide
Author_Institution :
Fac.of Eng., Kanagawa Univ., Yokohama, Japan
Abstract :
The 130 kHz and 180 kHz ultrasonic complex vibration systems with welding tips vibrating elliptical to circular locus effective for packaging in microelectronics were studied. These systems are effective for direct welding of various electronic devices without solder. The complex vibration sources are using a longitudinal-torsional vibration converter with diagonal slits and driven using longitudinal vibration systems.
Keywords :
copper; frequency convertors; polymers; welding; 130 to 180 kHz; circular locus; complex vibration sources; diagonal slits; electronic devices; longitudinal torsional vibration converter; longitudinal vibration systems; microelectronics; packaging; ultrasonic complex vibration converter; welding; welding tips; Cable insulation; Coatings; Copper; Electronics packaging; Frequency conversion; Microelectronics; Plastic insulation; Substrates; Welding; Wire;
Conference_Titel :
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN :
0-7803-7922-5
DOI :
10.1109/ULTSYM.2003.1293497
