Title :
Design of miniaturized RF SAW duplexer package
Author :
Dong, Hao ; Wu, Thomas X. ; Cheema, Kamran S. ; Abbott, Benjamin P. ; Finch, Craig A. ; Foo, Hanna
Author_Institution :
Univ. of Central Florida, Orlando, FL, USA
Abstract :
This paper provides a comprehensive methodology for accurate analysis and design of miniaturized RP SAW duplexer package. Full-wave analysis is applied to get the package model. Die and bonding wire modeling is also discussed. After that, improvement of the isolation is investigated. Simulation and measurement results are compared and excellent agreement is found. The technique developed in this paper reduces the design cycle time significantly and can be applied to various RP SAW device packages.
Keywords :
electronics packaging; lead bonding; surface acoustic wave filters; surface acoustic waves; RP SAW device packages; bonding wire modeling; die modeling; fullwave analysis; miniaturized RF SAW duplexer package design; radiofrequency surface acoustic waves; Bonding; Electronics packaging; Filters; Radio frequency; Radio transmitters; Receivers; Receiving antennas; Surface acoustic wave devices; Surface acoustic waves; Wire;
Conference_Titel :
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN :
0-7803-7922-5
DOI :
10.1109/ULTSYM.2003.1293523
