DocumentCode
411400
Title
Performance evaluation and reliability of thermal vias
Author
McCoy, B.S. ; Zimmermann, M.A.
Author_Institution
Rockwell Collins, Cedar Rapids, IA, USA
Volume
2
fYear
2004
fDate
2004
Firstpage
1250
Abstract
Establish a high-yield design approach for surface mount power packages utilizing PWB thermal vias, elastomeric material and heatsinks. A feasibility study proved that the thermal via concept could be implemented to meet cooling and producibility requirements. Reliability testing demonstrated negligible thermal path degradation for a 15-year life equivalent in airborne environment.
Keywords
elastomers; heat sinks; power semiconductor devices; printed circuit manufacture; printed circuits; reliability; surface mount technology; thermal management (packaging); PWB thermal vias; airborne environment; elastomeric material; heatsinks; performance evaluation; reliability testing; surface mount power packages; thermal path degradation; thermal via concept; thermal vias reliability; Assembly; Conducting materials; Energy management; Heat sinks; Maintenance; Manufacturing processes; Materials reliability; Packaging; Power supplies; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition, 2004. APEC '04. Nineteenth Annual IEEE
Print_ISBN
0-7803-8269-2
Type
conf
DOI
10.1109/APEC.2004.1295983
Filename
1295983
Link To Document