Title :
Performance evaluation and reliability of thermal vias
Author :
McCoy, B.S. ; Zimmermann, M.A.
Author_Institution :
Rockwell Collins, Cedar Rapids, IA, USA
Abstract :
Establish a high-yield design approach for surface mount power packages utilizing PWB thermal vias, elastomeric material and heatsinks. A feasibility study proved that the thermal via concept could be implemented to meet cooling and producibility requirements. Reliability testing demonstrated negligible thermal path degradation for a 15-year life equivalent in airborne environment.
Keywords :
elastomers; heat sinks; power semiconductor devices; printed circuit manufacture; printed circuits; reliability; surface mount technology; thermal management (packaging); PWB thermal vias; airborne environment; elastomeric material; heatsinks; performance evaluation; reliability testing; surface mount power packages; thermal path degradation; thermal via concept; thermal vias reliability; Assembly; Conducting materials; Energy management; Heat sinks; Maintenance; Manufacturing processes; Materials reliability; Packaging; Power supplies; Thermal conductivity;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2004. APEC '04. Nineteenth Annual IEEE
Print_ISBN :
0-7803-8269-2
DOI :
10.1109/APEC.2004.1295983
