DocumentCode
411521
Title
Scaling trends in DRAM technology
Author
Bronner, Gary
Author_Institution
IBM Microelectron., Hopewell Junction, NY, USA
fYear
2004
fDate
2004
Firstpage
19
Abstract
Summary form only given. Trends in scaling DRAM to 0.11 μm and below are reviewed. Scaling techniques used in earlier generations for the array access transistor and the storage capacitor are running into limitations, necessitating changes in electrical operating mode, cell structure, and processing innovations. Although a variety of options exist for advancing the technology, including low-voltage operation, non-planar array transistor MOSFETs, and novel capacitor structures and materials, uncertainties exist over the which of these will prove workable in manufacturing. This paper discusses the interrelationships among the DRAM scaling requirements and solutions.
Keywords
DRAM chips; MOS memory circuits; low-power electronics; 0.11 micron; DRAM technology scaling trends; array access transistor; low-voltage operation; nonplanar array transistor MOSFET; storage capacitor structure; Capacitors; MOSFETs; Manufacturing; Microelectronics; Random access memory; Technological innovation; Transistors; Uncertainty;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics and Electron Devices, 2004 IEEE Workshop on
Print_ISBN
0-7803-8369-9
Type
conf
DOI
10.1109/WMED.2004.1297339
Filename
1297339
Link To Document