• DocumentCode
    411521
  • Title

    Scaling trends in DRAM technology

  • Author

    Bronner, Gary

  • Author_Institution
    IBM Microelectron., Hopewell Junction, NY, USA
  • fYear
    2004
  • fDate
    2004
  • Firstpage
    19
  • Abstract
    Summary form only given. Trends in scaling DRAM to 0.11 μm and below are reviewed. Scaling techniques used in earlier generations for the array access transistor and the storage capacitor are running into limitations, necessitating changes in electrical operating mode, cell structure, and processing innovations. Although a variety of options exist for advancing the technology, including low-voltage operation, non-planar array transistor MOSFETs, and novel capacitor structures and materials, uncertainties exist over the which of these will prove workable in manufacturing. This paper discusses the interrelationships among the DRAM scaling requirements and solutions.
  • Keywords
    DRAM chips; MOS memory circuits; low-power electronics; 0.11 micron; DRAM technology scaling trends; array access transistor; low-voltage operation; nonplanar array transistor MOSFET; storage capacitor structure; Capacitors; MOSFETs; Manufacturing; Microelectronics; Random access memory; Technological innovation; Transistors; Uncertainty;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics and Electron Devices, 2004 IEEE Workshop on
  • Print_ISBN
    0-7803-8369-9
  • Type

    conf

  • DOI
    10.1109/WMED.2004.1297339
  • Filename
    1297339