Title :
Power characteristics of inductive interconnect
Author :
El-Moursy, Magdy A. ; Friedman, Eby G.
Author_Institution :
Dept. of Electr. & Comput. Eng., Rochester Univ., NY, USA
Abstract :
The power characteristics of inductive interconnect lines is presented. The matching condition between the driver and the load has an effect on the power consumption since the short-circuit power dissipation may decrease with increasing line width and the dynamic power increases. A tradeoff exists between the short-circuit and dynamic power in inductive interconnects. The short-circuit power increases with wider line widths if the line is underdriven. As the short-circuit power is directly proportional to the signal transition time, an analytic solution for the transition time with an error of less than 15% is presented. The solution can be used in wire sizing synthesis techniques to decrease the overall power dissipation.
Keywords :
CMOS logic circuits; RLC circuits; SPICE; circuit complexity; high-speed integrated circuits; integrated circuit interconnections; integrated circuit layout; lumped parameter networks; short-circuit currents; CMOS circuits; CMOS inverter; SPICE; dynamic power; high complexity; high speed integrated circuits; inductive interconnect lines; lumped RLC model; matching condition; on-chip interconnect; power characteristics; power consumption; short-circuit power; short-circuit power dissipation; signal transition time; wire sizing synthesis; Capacitance; Impedance; Integrated circuit interconnections; Load modeling; Power dissipation; Power transmission lines; Propagation losses; Semiconductor device modeling; Signal analysis; Threshold voltage;
Conference_Titel :
Electronics, Circuits and Systems, 2003. ICECS 2003. Proceedings of the 2003 10th IEEE International Conference on
Print_ISBN :
0-7803-8163-7
DOI :
10.1109/ICECS.2003.1301831
