• DocumentCode
    413469
  • Title

    Critical issues for Cu(InAl)Se/sub 2/ thin film solar cells

  • Author

    Shafarman, W.N. ; Marsillac, S. ; Minemoto, T. ; Paulson, P.D. ; Birkmire, R.W.

  • Author_Institution
    Inst. of Energy Conversion, Delaware Univ., Newark, DE, USA
  • Volume
    3
  • fYear
    2003
  • fDate
    18-18 May 2003
  • Firstpage
    2869
  • Abstract
    Cu(InAl)Se/sub 2/ thin film solar cells have been demonstrated with 16.9% efficiency using an absorber layer with Al/(In+Al)=0.13 giving a bandgap of 1.16 eV. However, the cell efficiency decreased as the Cu(InAl)Se/sub 2/ bandgap increased up to 1.7 eV. A critical development for these cells was the inclusion of a 5 nm thick Ga seed layer to improve the adhesion between the Cu(InAl)Se/sub 2/ and the Mo back contact. In this paper, critical issues for Cu(InAl)Se/sub 2/ thin film solar cells will be discussed, focusing on the film adhesion, and solar cell behavior with increasing bandgap. The effects of different flux-temperature-time profiles used for the elemental evaporation of Cu(InAl)Se/sub 2/ films, and different back contact structures will be characterized with respect to film morphology, structure, and adhesion, and to device behavior for Cu(InAl)Se/sub 2/ films with bandgaps from 1.1 to 1.5 eV. Finally, the prospects for Cu(InAl)Se/sub 2/ as the absorber layer in wide bandgap solar cells will be reviewed.
  • Keywords
    adhesion; aluminium compounds; copper compounds; energy gap; grain size; inclusions; indium compounds; semiconductor growth; semiconductor thin films; solar cells; surface morphology; vacuum deposition; Cu(InAl)Se/sub 2/ thin film solar cell; CuInAlSe/sub 2/; Ga seed layer; Mo; Mo back contact; absorber layer; cell efficiency; elemental evaporation; film adhesion; film morphology; film structure; flux temperature time profile; inclusion; wide bandgap solar cell;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, 2003. Proceedings of 3rd World Conference on
  • Conference_Location
    Osaka, Japan
  • Print_ISBN
    4-9901816-0-3
  • Type

    conf

  • Filename
    1305182