Title :
Cu(In/sub 1-x/,Ga/sub x/)Se/sub 2/ thin film solar cells using transparent conducting oxide back contacts for bifacial and tandem solar cells
Author :
Nakada, T. ; Hirabayashi, Yuji ; Tokado, T. ; Ohmori, D.
Author_Institution :
Dept. of Electr. Eng. & Electron., Aoyama Gakuin Univ., Kanagawa, Japan
Abstract :
Cu(In/sub 1-x/,Ga/sub x/)Se/sub 2/ (CIGS)-based thin film solar cells have been fabricated using transparent conducting oxide (TCO) back contacts allowing light to pass through the entire solar cell structure. The cell performance of CIGS devices using tin oxide (SnO/sub 2/) and indium tin oxide (ITO) back contacts were almost the same as that of a conventional CIGS solar cell fabricated using a Mo back contact. In contrast, fairly low efficiency was achieved for a device fabricated using a ZnO:Al back contact. The best cell performance was obtained using a substrate temperatures of 500-520/spl deg/C. However, the cell performance was observed to deteriorate above 550/spl deg/C. This is attributed to increased resistivity of the TCO´s due to the outdiffusion of fluorine dopant atoms from SnO/sub 2/ and the formation of a Ga/sub 2/O/sub 3/ interfacial layer on the ITO layer. We propose a low-cost bifacial CIGS thin film solar cell for the first time as one of the key applications of this type of CIGS device; preliminary results of cell performance are presented. A four-terminal tandem CIGS solar cell is also briefly discussed.
Keywords :
copper compounds; diffusion; electrical resistivity; fluorine; gallium compounds; indium compounds; ohmic contacts; semiconductor growth; semiconductor thin films; solar cells; ternary semiconductors; 500 to 520 degC; CuInGaSe/sub 2/; Ga/sub 2/O/sub 3/; Ga/sub 2/O/sub 3/ interfacial layer; ZnO:Al back contact; bifacial solar cell; fluorine doping; indium tin oxide back contact; outdiffusion; resistivity; solar cell structure; tandem solar cell; thin film solar cell; transparent conducting oxide back contact;
Conference_Titel :
Photovoltaic Energy Conversion, 2003. Proceedings of 3rd World Conference on
Conference_Location :
Osaka, Japan
Print_ISBN :
4-9901816-0-3