Title : 
Fast and easy single step module assembly for back-contacted c-Si solar cells with conductive adhesives
         
        
            Author : 
Bultman, J.H. ; Eikelboom, D.W.K. ; Kinderman, R. ; Tip, A.C. ; Tool, C.J.J. ; van den Nieuwenhof, M.A.C.J. ; Schoofs, C. ; Schuurmans, F.M. ; Weeber, A.W.
         
        
            Author_Institution : 
ECN Solar Energy, Petten, Netherlands
         
        
        
        
        
        
            Abstract : 
The simplest way to produce a module of crystalline silicon solar cells is with back-contacted cells that are glued on an interconnection foil using conductive adhesives. This foil also serves as environmental barrier at the rear of the module. The conductive adhesive is tuned to cure in the same cycle as the encapsulant. It is possible to interconnect the cells without any additional temperature curing in a single lamination step. The interconnection foil can be made for an acceptable cost price, as is shown in the paper. The savings in labor, a higher efficiency, and a yield increase will lead to a lower cost price for such a module. First results show that a module produced in a single step leads to similar fill factors as soldered modules.
         
        
            Keywords : 
elemental semiconductors; integrated circuit interconnections; silicon; solar cells; Si; back-contacted c-Si solar cell; conductive adhesive; efficiency; encapsulant; environmental barrier; fill factor; interconnection foil; single lamination step; single step module assembly;
         
        
        
        
            Conference_Titel : 
Photovoltaic Energy Conversion, 2003. Proceedings of 3rd World Conference on
         
        
            Conference_Location : 
Osaka, Japan
         
        
            Print_ISBN : 
4-9901816-0-3