Thin silicon cells using novel LASE process

We present a new concept for thin silicon solar cells. In the LASE process (Lateral Anisotropic Silicon Etching) shallow grooves are cut into a (111) oriented silicon wafer at regular intervals. Using alkaline etching, lateral channels are formed which extend underneath the silicon wafer and eventually meet to detach the silicon layer on top. Unlike other liftoff techniques, no silicon deposition is required. The technique can be used to produce silicon strips as well as continuous sheets. Silicon strips can be used to fabricate monolithically connected solar cells and high voltage, low current modules.