• DocumentCode
    413926
  • Title

    Improvement on actual output power of thin film silicon HYBRID module

  • Author

    Nakajima, Akihiko ; Ichikawa, Mitsuru ; Sawada, Toru ; Yoshimi, Masashi ; Fukuda, Susumu ; Tawada, Yuko ; Meguro, Tomomi ; Takata, Hironori ; Suezaki, Takashi ; Goto, Masahiro ; Hayashi, Katsuhiko ; Yamamoto, Kenji

  • Author_Institution
    Kaneka Corp., Otsu, Japan
  • Volume
    2
  • fYear
    2003
  • fDate
    18-18 May 2003
  • Firstpage
    1915
  • Abstract
    The I-V characteristics of thin film silicon HYBRID modules (a-Si/poly-Si stacked tandem solar-module) have been investigated under several spectral irradiance distributions. Spectral Match Analyzing Procedure (SMAP) revealed that the performance of HYBRID modules exposed under the sunlight tended to be limited by top a-Si cell due to the photo-degradation and the bottom poly-Si cell of our modules was stable. The performance of modules optimized at noon was 10% greater than at STC when the irradiance spectrum was close to AM1.0. The latest module exhibited the actual output current corresponding to the Jsc of 13 mA/cm/sup 2/ at the irradiance of 1.0 kW/m/sup 2/ in the natural sunlight, which had the efficiency of 13% and the Jsc of 13 mA/cm/sup 2/ at STC initially. The HYBRID module limited by the top cell exhibited the more efficient performance at noon. This behaviour was well understood by the trajectory analysis on the performance contour obtained by SMAP at varied module temperatures.
  • Keywords
    amorphous semiconductors; elemental semiconductors; semiconductor thin films; silicon; solar cells; Si-Si; Spectral Match Analyzing Procedure; amorphous Si-poly Si stacked tandem solar module; current-voltage curves; irradiance spectrum; photo degradation; thin film silicon HYBRID modules;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, 2003. Proceedings of 3rd World Conference on
  • Conference_Location
    Osaka, Japan
  • Print_ISBN
    4-9901816-0-3
  • Type

    conf

  • Filename
    1306314