DocumentCode :
413938
Title :
Climatic impact on the efficiency of a copper indium diselenide module
Author :
Durisch, Wilhelm ; Kiess, Helmut ; Lam, King-hang ; Close, Josie
Author_Institution :
Paul Scherrer Inst., Villigen, Switzerland
Volume :
2
fYear :
2003
fDate :
18-18 May 2003
Firstpage :
1968
Abstract :
The experiments investigate the influence of climatic parameters on the efficiency of a commercially available copper indium diselenide (CIS) module. The results allowed to develop a five-parameter model describing the efficiency as a function of irradiance, cell temperature and relative air mass. The model is indispensable to determine accurately the yearly output of CIS modules at different sites with given meteorology. Two quantities were calculated from the model as by-products, namely the cell efficiency at standard test conditions (STC) and the temperature coefficient of the cell efficiency at STC, being 11.6% and -0.050 abs.%//spl deg/C, respectively. The efficiency decreases linearly with cell temperature. However, the decrease is less pronounced than with crystalline silicon modules. The efficiency of the module is practically independent on air mass. This is in contrast to amorphous silicon modules as well as micro-morphous tandem and amorphous triple- junction silicon modules, which show a decrease in efficiency in the late afternoon due to the increasing air mass and a simultaneous red shift of the solar spectrum.
Keywords :
copper compounds; elemental semiconductors; indium compounds; semiconductor device models; solar cells; ternary semiconductors; CuInSe/sub 2/; cell efficiency; climatic impact; copper indium diselenide module; crystalline silicon module; five parameter model; irradiance; meteorology; relative air mass; standard test condition; temperature coefficient;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Energy Conversion, 2003. Proceedings of 3rd World Conference on
Conference_Location :
Osaka, Japan
Print_ISBN :
4-9901816-0-3
Type :
conf
Filename :
1306329
Link To Document :
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