DocumentCode :
414467
Title :
Extending the capability of 0.60 NA DUV stepper for contact hole lithography of 140 nm node DRAM technology
Author :
Staub, R. ; Pforr, R. ; Hennig, M. ; Thielscher, G. ; Handke, M. ; Hofman, Daniel
Author_Institution :
Infineon Technol. Dresden GmbH & Co OHG, Germany
fYear :
2004
fDate :
4-6 May 2004
Firstpage :
79
Lastpage :
83
Abstract :
We present a project where DUV Steppers have been successfully implemented as standard lithography tool for a critical contact layer on 140 nm node technology under running production conditions. The utilisation of older generation lithography tools has been possible by using alternating phase shift masks (altPSM). Since the altPSM offers a much wider process window compared to half tone phase shift masks (HTPSM), lithography of contact holes could be transferred from 248 nm DUV Scanner to 0.6 NA DUV stepper. Methods are described how the problems caused by worse lens aberration performance of older generation lithography tools could be overcome and the successfull implementation of the altPSM lithography into the production process could be achieved.
Keywords :
DRAM chips; phase shifting masks; ultraviolet lithography; 140 nm; 248 nm; DRAM technology; DUV scanner; DUV stepper; alternating phase shift masks; contact hole lithography; half tone phase shift masks; lens aberration; process window; production process; Contacts; Continuous production; Costs; Lenses; Lithography; Manufacturing processes; Phased arrays; Printing; Random access memory; Shape;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
Print_ISBN :
0-7803-8312-5
Type :
conf
DOI :
10.1109/ASMC.2004.1309540
Filename :
1309540
Link To Document :
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