DocumentCode :
414470
Title :
Real-time detection of resist strip failure at metal etch process equipment
Author :
Cha, Sang-Yeob ; Lee, Hyeokjae ; Chae, Seung-Ki
Author_Institution :
Fab Equipment Technol. Group, Samsung Electron. Co., Ltd., Gyeonggi, South Korea
fYear :
2004
fDate :
4-6 May 2004
Firstpage :
217
Lastpage :
220
Abstract :
Metal etch process is to form the electrical metal lines of device on a wafer. DPS of AMAT, the one of metal etch process equipments, is assembled chambers for metal etch process and resist strip process. The wafer proceeds metal etch process and resist strip process continuously. If resist were not removed clearly in the strip process chamber, its ash induces serious defect to metal lines. Despite such a failure has been randomly occurred in resist strip chamber, real-time detection of it was impossible under interlock system by using classical SPC. This paper shows how it is possible to detect resist strip failure in real-time by modeling. As a result, wafer loss by resist ash could be decreased effectively in the metal etch process.
Keywords :
etching; failure analysis; fault diagnosis; resists; semiconductor device manufacture; electrical metal line; metal etch process; metal etch process equipment; real time detection; resist strip failure analysis; strip process chamber; wafer loss; Ash; Condition monitoring; Etching; Fault detection; Real time systems; Resists; Semiconductor device modeling; Strips; Temperature sensors; Thermal sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
Print_ISBN :
0-7803-8312-5
Type :
conf
DOI :
10.1109/ASMC.2004.1309569
Filename :
1309569
Link To Document :
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