• DocumentCode
    41515
  • Title

    A Fully-Integrated 40–222 GHz InP HBT Distributed Amplifier

  • Author

    Sangwoo Yoon ; Lee, Inkyu ; Urteaga, M. ; Kim, Marn-Go ; Sanggeun Jeon

  • Author_Institution
    Sch. of Electr. Eng., Korea Univ., Seoul, South Korea
  • Volume
    24
  • Issue
    7
  • fYear
    2014
  • fDate
    Jul-14
  • Firstpage
    460
  • Lastpage
    462
  • Abstract
    This letter presents an ultra-wideband distributed amplifier (DA) implemented in a 250 nm InP HBT technology. Four cascode gain cells are distributed along the input and output microstrip lines to achieve wideband operation. Each cascode cell employs inductive peaking at the output to further enhance the bandwidth and to align the phase delay between the input and output lines. All dc bias components are fully integrated on-chip. The DA exhibits a measured gain of 10 dB with a 3 dB bandwidth extending from 40 to 222 GHz. The maximum output power was measured to be 6.0, 9.2, and 8.5 dBm at 60, 77, and 134 GHz, respectively, which allows the DA to also be used as a medium-power amplifier. To the authors´ best knowledge, the DA achieves the highest 3 dB bandwidth of 182 GHz reported thus far, while showing low dc power consumption (105 mW) compared to other state-of-the-art DAs.
  • Keywords
    III-V semiconductors; distributed amplifiers; heterojunction bipolar transistors; indium compounds; low-power electronics; microstrip lines; millimetre wave power amplifiers; InP; cascode cell; cascode gain cells; dc bias components; frequency 40 GHz to 222 GHz; fully integrated on-chip; fully-integrated InP HBT; gain 10 dB; low dc power consumption; medium power amplifier; microstrip lines; phase delay; power 105 mW; size 250 nm; ultrawideband distributed amplifier; Bandwidth; Gain; Heterojunction bipolar transistors; Indium phosphide; Power generation; Power measurement; System-on-chip; Distributed amplifier (DA); heterojunction bipolar transistor (HBT); indium phosphide (InP); monolithic microwave integrated circuit (MMIC);
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2014.2316223
  • Filename
    6827233