DocumentCode
415652
Title
Comparison of ultra-thin gate oxide ESD protection capability of silicided and silicide-blocked MOSFETS
Author
Lee, J.H. ; Shih, J.R. ; Yu, K.F. ; Wu, Y.A. ; Ong, T.C.
Author_Institution
Taiwan Semicond. Manuf. Co., Hsin-Chu, Taiwan
fYear
2004
fDate
25-29 April 2004
Firstpage
609
Lastpage
610
Abstract
In this paper, ultra-thin oxide ESD protection capability of silicided and silicide-blocked MOSFETs is studied. We find that ground Gate NMOSFETs (GGNMOS) with silicided drain can provide much better ultra-thin oxide ESD protection capability than the GGNMOS with silicide-blocked drain, and oxide damage is occurred at the transient before the device occurring the snapback. Because the device under the TLP and ESD has different discharge behaviors at the transient before the snapback, it results in that TLP test result does not correlate to ESD test result.
Keywords
CMOS integrated circuits; MOSFET; dielectric thin films; electrostatic discharge; integrated circuit reliability; semiconductor device breakdown; semiconductor device reliability; ground gate NMOSFETs; silicide-blocked MOSFETS; silicided MOSFET; snapback; ultra-thin gate oxide ESD protection capability; Breakdown voltage; Capacitance; Capacitors; Circuit testing; Electrostatic discharge; MOS devices; MOSFETs; Protection; Silicides; Variable structure systems;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
Print_ISBN
0-7803-8315-X
Type
conf
DOI
10.1109/RELPHY.2004.1315413
Filename
1315413
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