• DocumentCode
    415652
  • Title

    Comparison of ultra-thin gate oxide ESD protection capability of silicided and silicide-blocked MOSFETS

  • Author

    Lee, J.H. ; Shih, J.R. ; Yu, K.F. ; Wu, Y.A. ; Ong, T.C.

  • Author_Institution
    Taiwan Semicond. Manuf. Co., Hsin-Chu, Taiwan
  • fYear
    2004
  • fDate
    25-29 April 2004
  • Firstpage
    609
  • Lastpage
    610
  • Abstract
    In this paper, ultra-thin oxide ESD protection capability of silicided and silicide-blocked MOSFETs is studied. We find that ground Gate NMOSFETs (GGNMOS) with silicided drain can provide much better ultra-thin oxide ESD protection capability than the GGNMOS with silicide-blocked drain, and oxide damage is occurred at the transient before the device occurring the snapback. Because the device under the TLP and ESD has different discharge behaviors at the transient before the snapback, it results in that TLP test result does not correlate to ESD test result.
  • Keywords
    CMOS integrated circuits; MOSFET; dielectric thin films; electrostatic discharge; integrated circuit reliability; semiconductor device breakdown; semiconductor device reliability; ground gate NMOSFETs; silicide-blocked MOSFETS; silicided MOSFET; snapback; ultra-thin gate oxide ESD protection capability; Breakdown voltage; Capacitance; Capacitors; Circuit testing; Electrostatic discharge; MOS devices; MOSFETs; Protection; Silicides; Variable structure systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
  • Print_ISBN
    0-7803-8315-X
  • Type

    conf

  • DOI
    10.1109/RELPHY.2004.1315413
  • Filename
    1315413