DocumentCode :
415855
Title :
A new MEMS optimal design method using CASE
Author :
Mamiya, Hiroki ; Ishikawa, Koji ; Yu, Qiang
Author_Institution :
Dept. of Mech. Eng., Yokohama Nat. Univ., Japan
Volume :
2
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
529
Abstract :
We report on the development of a new micro-electro-mechanical systems (MEMS) optimal design method called Computer Aided System Evaluation (CASE), which supports the total system evaluation of MEMS devices before the design stage. Recently total system simulation and design using CAE (Computer Aided Engineering) analyses have become important in MEMS device development due to their fabrication and design complexity. Although a lot of CAE methods that can be applied to MEMS have been demonstrated, time-consuming trial-and-error processes are inevitable at the design stage in order to obtain an optimal structure. In our design method, we can clarify and simplify the relation between design parameters and the system characteristics using a CASE weighted orthogonal array. In the CASE array, the sensitivity of each design factor for the system performance shows numerically how the design parameter influences the system characteristics. The existent trade-offs between design parameters can be minimized by both modifying the design concept and adjusting the sensitivities. Therefore MEMS designers are able to optimize the total system based on the information from the CASE array. Moreover, particular system characteristics can be enhanced in order to meet the system requirement through the adjustment of weight values for the sensitivities. The CASE makes the evaluation of system validity possible at the concept design stage. To conduct the informative optimal design method at the beginning of development leads the reduction of the total MEMS design time and cost.
Keywords :
finite element analysis; micromechanical devices; micromirrors; Computer Aided Engineering; Computer Aided System Evaluation; MEMS devices; MEMS optimal design method; design factor; design parameters; error processes; microelectromechanical systems; numerical analysis; time-consuming trial processes; Analytical models; Computational modeling; Computer aided engineering; Computer aided software engineering; Computer simulation; Design methodology; Fabrication; Microelectromechanical devices; Microelectromechanical systems; Micromechanical devices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN :
0-7803-8357-5
Type :
conf
DOI :
10.1109/ITHERM.2004.1318329
Filename :
1318329
Link To Document :
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