Title :
Packaging image sensor devices for camera module applications
Author :
Darveaux, Robert ; Chowdhury, Asif ; Tome, Jay ; Schoonejongen, Ron ; Reifel, Mitch ; De Guzman, Archie ; Park, Sung Soon
Author_Institution :
Amkor Technol. Inc., Chandler, AZ, USA
Abstract :
Production of image sensor devices has increased dramatically in recent years due to wide scale adoption of camera modules in mobile phones. It is expected that over 150M camera modules will be shipped in mobile phones in 2004. The packaging of an image sensor in a camera module presents several unique engineering challenges. Materials selection, assembly process, optical test, and facilities control are all areas where technology is rapidly developing. This paper focuses on current challenges, and highlights several areas where advances in research and development are needed.
Keywords :
cameras; image sensors; mobile handsets; modules; packaging; 150M camera modules; assembly process; camera module applications; facilities control; materials selection; mobile phones; optical test; packaging image sensor devices; Assembly; Cameras; Image sensors; Materials testing; Mobile handsets; Optical control; Optical materials; Optical sensors; Packaging; Production;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN :
0-7803-8357-5
DOI :
10.1109/ITHERM.2004.1319149
