The creation of thermal sub-models of electronic components using model reduction

This paper presents a new approach to thermal modeling using sub-models. We show how to efficiently create thermal sub-models based on a multi dimensional model reduction technique. These sub-models are then used to allow for fast simulation of complex parts and build higher order sub-models. In the paper multi dimensional thermal sub-models of realistic IC components such as an MMIC power amplifier for a fiber optic transmitter system and a generic multi-chip module ball grid array package are generated. Each sub-model is attached to a base detailed model such as a PCB or substrate, creating a thermal model of the entire system, allowing a quick thermal analysis to be performed of large systems. The thermal sub-models presented demonstrate a small model size, short simulation time, and high accuracy in the prediction of all internal temperatures with an error less than 2.5%.