• DocumentCode
    415921
  • Title

    A passive solution to a difficult data center environmental problem

  • Author

    Wang, David

  • Author_Institution
    Teradata, Div. of NCR Corp., San Diego, CA, USA
  • fYear
    2004
  • fDate
    1-4 June 2004
  • Firstpage
    586
  • Abstract
    Meeting cooling requirements for hardware cabinets clustered in long and multiple rows and congested in a tight space has proven to be a non-trivial task due to the complexity of dynamics that dictates the cold air delivery in a raised floor data center. The difficulties are compounded when much more cooling air is required for a given footprint to sufficiently cool equipment dissipating dramatically more power at much higher packaging and power densities. As a result of under supply of chilled air to hardware cabinets sitting on raised floor, cooling air temperatures at the inlet of each individual chassis behind a conventional, substantially perforated cabinet door can vary over quite a wide range with high temperature rises and therefore low hardware reliability and availability. This paper describes a new cabinet door design approach that effectively and practically minimizes inlet air temperature rise encountered in most data centers worldwide. Deviating from conventional cabinet door design with inlet vents covering nearly the entire door front, the new door will have a relatively small inlet area located only in the front near the bottom. Test results indicated that the new door can reduce temperature rise from about 8°C using a conventional door to 1-2°C for a specific test configuration.
  • Keywords
    air conditioning; computer centres; doors; temperature control; thermal management (packaging); 8 degC; chilled air supply; cooling air temperatures; door chassis; environmental problem; hardware cabinet door design; hardware reliability; inlet air temperature rise; inlet vents; packaging; power density; power dissipation; raised floor data center; Data processing; Energy consumption; Environmental factors; Hardware; Packaging machines; Space cooling; Temperature distribution; Testing; Tiles; Vents;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
  • Print_ISBN
    0-7803-8357-5
  • Type

    conf

  • DOI
    10.1109/ITHERM.2004.1319228
  • Filename
    1319228