DocumentCode :
415921
Title :
A passive solution to a difficult data center environmental problem
Author :
Wang, David
Author_Institution :
Teradata, Div. of NCR Corp., San Diego, CA, USA
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
586
Abstract :
Meeting cooling requirements for hardware cabinets clustered in long and multiple rows and congested in a tight space has proven to be a non-trivial task due to the complexity of dynamics that dictates the cold air delivery in a raised floor data center. The difficulties are compounded when much more cooling air is required for a given footprint to sufficiently cool equipment dissipating dramatically more power at much higher packaging and power densities. As a result of under supply of chilled air to hardware cabinets sitting on raised floor, cooling air temperatures at the inlet of each individual chassis behind a conventional, substantially perforated cabinet door can vary over quite a wide range with high temperature rises and therefore low hardware reliability and availability. This paper describes a new cabinet door design approach that effectively and practically minimizes inlet air temperature rise encountered in most data centers worldwide. Deviating from conventional cabinet door design with inlet vents covering nearly the entire door front, the new door will have a relatively small inlet area located only in the front near the bottom. Test results indicated that the new door can reduce temperature rise from about 8°C using a conventional door to 1-2°C for a specific test configuration.
Keywords :
air conditioning; computer centres; doors; temperature control; thermal management (packaging); 8 degC; chilled air supply; cooling air temperatures; door chassis; environmental problem; hardware cabinet door design; hardware reliability; inlet air temperature rise; inlet vents; packaging; power density; power dissipation; raised floor data center; Data processing; Energy consumption; Environmental factors; Hardware; Packaging machines; Space cooling; Temperature distribution; Testing; Tiles; Vents;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN :
0-7803-8357-5
Type :
conf
DOI :
10.1109/ITHERM.2004.1319228
Filename :
1319228
Link To Document :
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