DocumentCode
415923
Title
Airborne electronics equipment fastener joint failure study
Author
Wang, Frank Fan
Author_Institution
Crane Aerosp. & Electron., Lynnwood, WA, USA
fYear
2004
fDate
1-4 June 2004
Firstpage
607
Abstract
Wherever multiple pieces of material are attached together, interfacial thermal resistance exists. In order to achieve maximum interfacial heat transfer, highest possible interfacial pressure is desired. However, due to the constraints of the material property, there is a practical limit of interfacial pressure. In many cases, the interfacial pressure is achieved by using fasteners. When the fastener is tightened the stress and elasticity of the material will create a preload, thus the interfacial pressure. This paper studies two kinds of fastener failures in electronics: loss of preload and excessive preload. Loss of preload (or loose) is easier to understand and may be visible by inspection. Excessive preload failure is much harder to detect and comprehend, thus often ignored. This paper is researching the common failures of the electronic packaging associated with the fastener torque values. The study presents an engineering solution regarding torque values and locking mechanisms. It also presents a simplified conservative engineering calculation method regarding interfacial thermal resistance based on test data.
Keywords
elasticity; electronics packaging; failure analysis; inspection; internal stresses; mechanical contact; thermal resistance; torque; airborne electronics equipment; conservative engineering calculation; elasticity; electronic packaging; excessive preload failure; fastener joint failure; inspection; interfacial pressure; interfacial thermal resistance; locking mechanism; material property; maximum interfacial heat transfer; preload loss; stress; test data; torque; Elasticity; Electronic equipment; Electronics packaging; Fasteners; Heat transfer; Inspection; Material properties; Stress; Thermal resistance; Torque;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN
0-7803-8357-5
Type
conf
DOI
10.1109/ITHERM.2004.1319231
Filename
1319231
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