• DocumentCode
    415924
  • Title

    Electronics packaging simplified radiation heat transfer analysis method

  • Author

    Wang, Frank Fan

  • Author_Institution
    Crane Aerosp. & Electron., Lynnwood, WA, USA
  • fYear
    2004
  • fDate
    1-4 June 2004
  • Firstpage
    613
  • Abstract
    Some electronics packaging engineers choose to ignore radiation heat transfer calculation, because 1) radiation heat transfer are insignificant compared with convection and conduction; 2) to provide safety factor in thermal design; 3) building a radiation model is time consuming. These reasons are true in some cases, wrong in many others. The answer depends on the material and thermal condition. This paper studies the radiation phenomenal in electronic packaging; identifies dominating factors; presents engineering guidelines of when, where and why the radiation heat transfer can be ignored and how to use simplified radiation heat transfer method to save time and budget in certain circumstances. A few real world examples of radiation heat transfer consideration are given.
  • Keywords
    electronics packaging; heat conduction; heat radiation; natural convection; convection; electronics packaging; heat conduction; radiation heat transfer analysis; safety factor; thermal design; time consuming; Buildings; Design engineering; Electronic packaging thermal management; Electronics packaging; Heat engines; Heat transfer; Radiation safety; Thermal conductivity; Thermal engineering; Thermal factors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
  • Print_ISBN
    0-7803-8357-5
  • Type

    conf

  • DOI
    10.1109/ITHERM.2004.1319232
  • Filename
    1319232