DocumentCode
415924
Title
Electronics packaging simplified radiation heat transfer analysis method
Author
Wang, Frank Fan
Author_Institution
Crane Aerosp. & Electron., Lynnwood, WA, USA
fYear
2004
fDate
1-4 June 2004
Firstpage
613
Abstract
Some electronics packaging engineers choose to ignore radiation heat transfer calculation, because 1) radiation heat transfer are insignificant compared with convection and conduction; 2) to provide safety factor in thermal design; 3) building a radiation model is time consuming. These reasons are true in some cases, wrong in many others. The answer depends on the material and thermal condition. This paper studies the radiation phenomenal in electronic packaging; identifies dominating factors; presents engineering guidelines of when, where and why the radiation heat transfer can be ignored and how to use simplified radiation heat transfer method to save time and budget in certain circumstances. A few real world examples of radiation heat transfer consideration are given.
Keywords
electronics packaging; heat conduction; heat radiation; natural convection; convection; electronics packaging; heat conduction; radiation heat transfer analysis; safety factor; thermal design; time consuming; Buildings; Design engineering; Electronic packaging thermal management; Electronics packaging; Heat engines; Heat transfer; Radiation safety; Thermal conductivity; Thermal engineering; Thermal factors;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN
0-7803-8357-5
Type
conf
DOI
10.1109/ITHERM.2004.1319232
Filename
1319232
Link To Document