Thermal evaluation of DC/DC and PFC integrated power electronics modules

Author

Pang, Ying-Feng ; Scott, Elaine P.

Author_Institution

Dept. of Mech. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA

fYear

2004

fDate

1-4 June 2004

Firstpage

700

Abstract

This paper presents the thermal evaluations of a direct current/direct current (DC/DC) integrated power electronics module (IPEM) and a power factor correction (PFC) IPEM employing the embedded power technology. Experimental and numerical approaches were used to characterize both IPEMs under forced air convection conditions. Finally, the significance of the planar metallization layer to the heat flow within the IPEM was investigated.

Keywords

convection; integrated circuit metallisation; integrated circuit modelling; integrated circuit packaging; integrated circuit testing; power MOSFET; power factor correction; power integrated circuits; thermal analysis; DC-DC integrated power electronics modules; direct current-direct current integrated power electronics module; embedded power technology; forced air convection; heat flow; numerical analysis; planar metallization layer; power factor correction; thermal evaluation; Ceramics; Electronic packaging thermal management; Electronics packaging; MOSFET circuits; Metallization; Plastic packaging; Power electronics; Power system modeling; Silicon carbide; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on

Print_ISBN

0-7803-8357-5

Type

conf

DOI

10.1109/ITHERM.2004.1319244

Filename

1319244