System-on-a-package (SOP) substrate and module with digital, RF and optical integration

The Packaging Research Center has been developing next generation system-on-a-package (SOP) technology with digital, RF, and optical system integration on a single package. SOP aims to utilize the best of on-chip SOC integration and package integration to achieve the highest system performance at the lowest cost. The micro-miniaturized multi-functional SOP package is highly integrated and fabricated on large area substrates similar to the wafer-to-IC concept. In addition to novel mixed signal design methodologies, SOP research at PRC is targeted at developing enabling technologies for package level integration including ultra-high density wiring, embedded passive components, embedded optical interconnects, wafer level packaging and fine pitch assembly. Several of these enabling technologies have been recently integrated into the first successful system level demonstration of SOP technology using the intelligent network communicator (INC) testbed. This paper reports on the latest INC and SOP testbed results at the PRC and provides an insight into the future SOP integration strategy for convergent microsystems. The focus of this paper is on integration of materials, processes and structures in a single package substrate for system-on-a-package (SOP) implementation.