Process development and reliability for system-in-a-package using liquid crystal polymer substrate

Author

Chen, Liu ; Duo, Xingzhong ; Zheng, Lirong ; Lai, Zonghe ; Liu, Johan

Author_Institution

Div. of Electron. Production, Chalmers Univ. of Technol., Gothenburg, Sweden

Volume

1

fYear

2004

fDate

1-4 June 2004

Firstpage

24

Abstract

In this study, embedded chip technology for system-in-a-package (SiP) application using liquid crystal polymer (LCP) substrate was developed and the reliability issue for embedded structure was evaluated. To this end two test chips with daisy chain joints were used with one copper layer. After assembly, modules were exposed to thermal cycling. The failure was investigated by SEM, and compared with finite element method (FEM) simulation results. Passive components as inductors were also fabricated on the LCP during the embedded technology. Their inductance and quality factors were simulated and discussed.

Keywords

Q-factor; finite element analysis; inductance; inductors; integrated circuit packaging; integrated circuit reliability; liquid crystal polymers; scanning electron microscopy; substrates; system-on-chip; thermal analysis; SEM; SiP; component inductance; daisy chain joints; embedded chip reliability; finite element simulation; inductor quality factor; liquid crystal polymer substrate; scanning electron microscope; system-in-a-package; test chips; thermal cycling; Copper; Dielectric substrates; Electronic packaging thermal management; Electronics packaging; Flip chip; Inductors; Laboratories; Liquid crystal polymers; Testing; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1319310

Filename

1319310