Title :
Development on wafer level anisotropic conductive film for flip-chip interconnection
Author :
Souriau, Jean-Charles ; Brun, Jean ; Franiatte, Rémi ; Gasse, Adrien
Author_Institution :
CEA-Grenoble-LETI, Grenoble, France
Abstract :
With the fast growth of multimedia, the packaging has to satisfy high interconnection density, high data throughput, miniaturization, easy thermal management and reliability needs while keeping a low cost. Flip-chip, which probably offers the best solution to meet these requirements, has been chosen by major companies in various configurations: FCOB (flip-chip on board), WLCSP (wafer level chip scale package) and WLP (wafer level packaging). Flip-chip interconnection using micro-balls is a common interconnection technique and major developments are being carried out on wafer bumping. In this paper, a new bumping approach on the IC wafer with z-axis ACF (anisotropic conductive film) is presented. This WL-ACF concept proposes a universal solution for bumping as there is no specific rule design to be taken into account. Moreover, the z-axis ACF developed at CEA-LETI gives the possibility of achieving lower pitch and pad area as well as good electrical contact and reliability. WL-ACF is evaluated on a specific test vehicle assembly and compared with localized micro insert bumping and hybridization with standard ACF.
Keywords :
anisotropic media; chip scale packaging; contact resistance; fine-pitch technology; flip-chip devices; integrated circuit interconnections; integrated circuit reliability; FCOB; WL-ACF; WLCSP; WLP; contact resistance; electrical contact reliability; fine pitch connections; flip-chip interconnection; flip-chip on board; high interconnection density; micro-balls; small pad area; wafer bumping; wafer level anisotropic conductive film; wafer level chip scale package; wafer level packaging; z-axis ACF; Anisotropic conductive films; Assembly; Chip scale packaging; Contacts; Costs; Testing; Thermal management; Throughput; Vehicles; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1319329