Title :
Hygro-thermo-mechanical behavior of molding compounds at elevated environments
Author :
Yi, Sung ; Yu, Zeyan ; Neo, Raynard ; Lee, Yeong J.
Author_Institution :
Dept. of Mech. Eng., Portland State Univ., OR, USA
Abstract :
In this study, the time, temperature and moisture dependent properties of polymer molding compounds used for plastic IC packages are investigated experimentally. The moisture absorption in the molding compound is determined at various environmental conditions. The creep behaviors of molding compounds are measured at various temperatures below the glass transition and in various humidity conditions. The experimental results show that moisture content and temperature significantly affect the mechanical behavior of the material. The increase of moisture content results in increasing the magnitudes of strains remarkably. The time function of its compliance is also characterized and the shift function is evaluated.
Keywords :
creep; elastic constants; environmental degradation; integrated circuit packaging; moisture; moulding; plastic packaging; polymers; viscoelasticity; compliance time function; compound creep behavior; elevated humidity environments; elevated temperature environments; epoxy molding compounds; glass transition temperature; material strain; moisture absorption; moisture content; moisture dependent properties; molding compound hygro-thermo-mechanical behavior; plastic IC packages; polymer molding compounds; shift function; temperature dependent properties; time dependent properties; viscoelastic effects; Absorption; Capacitive sensors; Creep; Glass; Humidity measurement; Moisture; Plastic integrated circuit packaging; Polymers; Temperature dependence; Temperature measurement;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1319334
