DocumentCode :
415958
Title :
Optical SMT-packaging for highly efficient and reliable fiber optic components including 1300nm VCSELs
Author :
Althaus, Hans L. ; Melinde, Marco ; Steinle, Gunther ; Weigert, Martin ; Wietschorke, Helmut
Author_Institution :
Infineon Technol. AG, Regensburg, Germany
Volume :
1
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
192
Abstract :
In the presented packaging technology for optical SMT-components, a standard non-optical transparent mould compound is used. The optical access is realized by a prepared aperture in the metallic lead frame of the exposed die pad, which also enables at the same time a high precision fixation to the optical fiber. This principle made it possible to realize an optical clear plane or lensed window as submount surface to the inner electro-optical chips for focused light emission from/to the single mode-fiber. In using an overall non-optic transparent mould compound for packaging, the optical path is completely enclosed in a transparent solid state chip environment. The application of an innovative flip-chip and chip-on-chip technology on the base and the consequent use of wafer processes for hybrid assembling and test made it possible to realize an efficient assembling technology of different multichip-configurations of optical passive and active chips in optical-SMT-packages, e.g. "optical-TSSOP10" on a standard TSSOP-production line. The realisation of a rational well adapted SMT-package for a 1300 nm VCSEL-component, as an O-TSSOP10-VCSEL with coupled SMF access, shows the importance of the optical SMT-packaging for fiber optical applications with transmission rates up to 10 Gbit/s.
Keywords :
flip-chip devices; integrated circuit packaging; integrated optoelectronics; microassembling; moulding; optical communication equipment; optical fibre communication; semiconductor device packaging; surface emitting lasers; surface mount technology; 10 Gbit/s; 1300 nm; VCSEL; assembling technology; chip on chip technology; fiber optic components; fiber optical transmission rates; flip-chip technology; focused light transmission; hybrid assembling; lensed window; metallic lead frame optical access aperture; multichip-configurations; nonoptical transparent mould compound; optical SMT-packaging; optical active chips; optical clear plane; optical fiber attachment; optical passive chips; optical-TSSOP10; single mode-fiber coupling; Apertures; Assembly; Lead; Optical devices; Optical fibers; Packaging; Solid state circuits; Stimulated emission; Testing; Vertical cavity surface emitting lasers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
Type :
conf
DOI :
10.1109/ECTC.2004.1319336
Filename :
1319336
Link To Document :
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