• DocumentCode
    415962
  • Title

    Packaging of a high-speed optical modulator using flip chip interconnects

  • Author

    Visagathilagar, Y.S. ; Rowe, W.S.T. ; Mitchell, A. ; Bennett, G. ; Grosser, M.

  • Author_Institution
    Australian Photonics CRC, R. Melbourne Inst. of Technol., Vic., Australia
  • Volume
    1
  • fYear
    2004
  • fDate
    1-4 June 2004
  • Firstpage
    212
  • Abstract
    Optical modulators using lithium niobate (LiNbO3) have become the industry standard for high-speed data transmission and RF photonic links. Packaging is a determining factor in maintaining low cost and high-performance. This paper investigates the application of flip chip technology to optical modulator packaging. Experimental results show that rugged flip chip bonds can be realized with minimal impact on the modulator electrical performance.
  • Keywords
    electro-optical modulation; flip-chip devices; interconnections; lithium compounds; semiconductor device packaging; LiNbO3; RF photonic links; flip chip interconnects; high-speed data transmission links; high-speed optical modulator; modulator packaging; rugged flip chip bonds; Bonding; Electrodes; Flip chip; High speed optical techniques; Optical interconnections; Optical interferometry; Optical modulation; Optical sensors; Packaging; Radio frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2004. Proceedings. 54th
  • Print_ISBN
    0-7803-8365-6
  • Type

    conf

  • DOI
    10.1109/ECTC.2004.1319340
  • Filename
    1319340
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=415962