Title :
Packaging of a high-speed optical modulator using flip chip interconnects
Author :
Visagathilagar, Y.S. ; Rowe, W.S.T. ; Mitchell, A. ; Bennett, G. ; Grosser, M.
Author_Institution :
Australian Photonics CRC, R. Melbourne Inst. of Technol., Vic., Australia
Abstract :
Optical modulators using lithium niobate (LiNbO3) have become the industry standard for high-speed data transmission and RF photonic links. Packaging is a determining factor in maintaining low cost and high-performance. This paper investigates the application of flip chip technology to optical modulator packaging. Experimental results show that rugged flip chip bonds can be realized with minimal impact on the modulator electrical performance.
Keywords :
electro-optical modulation; flip-chip devices; interconnections; lithium compounds; semiconductor device packaging; LiNbO3; RF photonic links; flip chip interconnects; high-speed data transmission links; high-speed optical modulator; modulator packaging; rugged flip chip bonds; Bonding; Electrodes; Flip chip; High speed optical techniques; Optical interconnections; Optical interferometry; Optical modulation; Optical sensors; Packaging; Radio frequency;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1319340
