Title : 
Ultra compact optical subassembly using integrated laser diode and silicon microlens for low-cost optical component
         
        
            Author : 
Shimura, Daisuke ; Uekawa, Masahiro ; Sekikawa, Ryo ; Kotani, Kyoko ; Maeno, Yoshinori ; Sasaki, Hironori ; Takamori, Takeshi
         
        
            Author_Institution : 
R&D Center, Oki Electr. Ind. Co. Ltd., Tokyo, Japan
         
        
        
        
        
        
            Abstract : 
We have succeeded in developing an ultra compact optical subassembly (OSA) that consists of a pre-aligned Si microlens and a laser diode (LD) integrated on a Si V-groove substrate with a footprint less than 1 mm by 1 mm. This OSA is small enough to be mounted on a TO-CAN package such as TO38, making the resulting optical component ultra compact in size and reducing the packaging process cost. A coupling efficiency better than -2.6 dB between the OSA and a single-mode fiber (SMF) has been experimentally confirmed. The experimental results show the OSA´s applicability to metro networks, making the OSA a promising candidate for low-cost and high-performance optical components.
         
        
            Keywords : 
elemental semiconductors; integrated optoelectronics; metropolitan area networks; microlenses; modules; optical transmitters; semiconductor device packaging; silicon; 1 mm; OSA; Si; V-groove substrate; integrated laser diode; low-cost optical component; metro networks; optical modules; pre-aligned microlens; silicon microlens; single-mode fiber coupling efficiency; ultra compact optical subassembly; Diode lasers; Integrated optics; Lenses; Microoptics; Optical devices; Optical feedback; Optical receivers; Optical transmitters; Packaging; Silicon;
         
        
        
        
            Conference_Titel : 
Electronic Components and Technology Conference, 2004. Proceedings. 54th
         
        
            Print_ISBN : 
0-7803-8365-6
         
        
        
            DOI : 
10.1109/ECTC.2004.1319341