Advanced decoupling in high performance IC packaging

This paper describes progress in the implementation of the Stealth™ decoupling capacitor in high performance IC packaging applications. The Stealth is an integrable or surface-mountable capacitor with superior electrical performance characteristics compared with conventional surface mount devices. Simulations showing the effectiveness of the capacitor in reducing power distribution noise in IC packages are presented and a current application is discussed. Measurements on actual devices, demonstrating the sensitivity of decoupling effectiveness to intervening power distribution inductance, are shown. Finally, data on the reliability of the devices is presented. The use of the Stealth as part of a hierarchy of decoupling in the context of an advanced power distribution system is examined and ways of integrating the Stealth into a printed wiring board or BGA substrate are discussed. Also, a program under way to demonstrate this integration is described.