Title :
Challenges of small form factor 0402 and 0201 die side capacitor assembly process on high density interconnect flip chip substrate
Author :
Loke, C.C. ; Cheong, Chin-Thong ; Goh, Hun-Song ; Wagiman, Amir Nur Rashid
Author_Institution :
Assembly Technol. Dev., Intel Technol. (M) Sdn Bhd, Penang, Malaysia
Abstract :
This paper summarizes all the challenges in enabling the low cost high volume manufacturing (HVM) process to attach "ultra mini" 0201/0402 die side capacitors (DSC) onto a small form factor high density interconnect (HDI) flip chip substrate. The key focus areas are on the optimum DSC pad design, stencil design, paste printing, capacitor terminal control and component pickup accuracy.
Keywords :
assembling; capacitors; electronics packaging; flip-chip devices; 0201 capacitor; 0402 capacitor; DSC pad design; HDI; HVM process; capacitor assembly process; capacitor terminal control; component pickup accuracy; die side capacitor; flip chip substrate; high density interconnect substrate; low cost high volume manufacturing; paste printing; small form factor capacitor; stencil design; Assembly; Capacitors; Costs; Flip chip; Inspection; Packaging; Power system interconnection; Printing; Silicon; System performance;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1319362
