Title :
Manufacturability and reliability of different size wirebonds on different Al pad structures
Author :
Sauter, Wolfgang ; Aoki, Toyohiro ; Hisada, Takashi ; Beaulieu, Frederic ; Allard, Stephanie ; Ostrowski, Kevin
Author_Institution :
IBM Corp., Essex Junction, VT, USA
Abstract :
The manufacturability and reliability of wirebonds depends on many factors, most of which are linked to the BEOL wafer fabrication process. This paper presents a detailed experimental analysis of the effect of pad thickness and liner levels on the quality of the interconnection. Varying ball sizes are evaluated and compared for different target pitch applications. Thermal aging of the wirebonds with subsequent wire pull and ball shear was studied and the challenges of this test are described.
Keywords :
ageing; aluminium; integrated circuit interconnections; integrated circuit reliability; lead bonding; shear strength; Al; BEOL wafer fabrication process; ball shear test; ball size; interconnection quality; pad liner levels; pad structures; pad thickness; thermal aging; wire pull test; wirebond manufacturability; wirebond reliability; wirebond size; Aluminum; Atherosclerosis; CMOS technology; Copper; Flip chip; Gold; Manufacturing processes; Performance evaluation; Semiconductor device manufacture; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1319364
