Analysis of coupling suppression methods on split power/ground planes using embedded capacitor in multi-layered package

Author

Jeong, Youchul ; Lu, Albert Chee W ; Wai, Lai L. ; Fan, Wei ; Lok, Boon K. ; Kim, Joungho

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejon, South Korea

Volume

1

fYear

2004

fDate

1-4 June 2004

Firstpage

575

Abstract

Various noise suppression methods using embedded capacitors are analyzed and verified by frequency domain measurement and full wave simulation up to 10 GHz frequency range. In this paper, especially, the noise coupling suppression methods on split power/ground plane in the multi-layered packages are analyzed.

Keywords

circuit simulation; electromagnetic coupling; frequency-domain analysis; integrated circuit noise; integrated circuit packaging; interference suppression; power supply circuits; thin film capacitors; 10 GHz; coupling suppression methods; embedded capacitor; frequency domain measurement; frequency range; full wave simulation; multi-layered package; multi-layered packages; noise coupling suppression methods; noise suppression methods; split power/ground plane; split power/ground planes; Capacitance; Capacitors; Dielectric thin films; Frequency; High-K gate dielectrics; Inductance; Land vehicles; Packaging; Road vehicles; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1319396

Filename

1319396