Title :
Analysis of coupling suppression methods on split power/ground planes using embedded capacitor in multi-layered package
Author :
Jeong, Youchul ; Lu, Albert Chee W ; Wai, Lai L. ; Fan, Wei ; Lok, Boon K. ; Kim, Joungho
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejon, South Korea
Abstract :
Various noise suppression methods using embedded capacitors are analyzed and verified by frequency domain measurement and full wave simulation up to 10 GHz frequency range. In this paper, especially, the noise coupling suppression methods on split power/ground plane in the multi-layered packages are analyzed.
Keywords :
circuit simulation; electromagnetic coupling; frequency-domain analysis; integrated circuit noise; integrated circuit packaging; interference suppression; power supply circuits; thin film capacitors; 10 GHz; coupling suppression methods; embedded capacitor; frequency domain measurement; frequency range; full wave simulation; multi-layered package; multi-layered packages; noise coupling suppression methods; noise suppression methods; split power/ground plane; split power/ground planes; Capacitance; Capacitors; Dielectric thin films; Frequency; High-K gate dielectrics; Inductance; Land vehicles; Packaging; Road vehicles; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1319396
