Intermetallic morphology and damage evolution under thermomechanical fatigue of lead (Pb)-free solder interconnections

Author

Dunford, Steven ; Canumalla, Sridhar ; Viswanadharn, P.

Volume

1

fYear

2004

fDate

1-4 June 2004

Firstpage

726

Abstract

The variety and complexity of intermetallic morphologies are highlighted in this paper along with their role in defining failure under thermal fatigue. Some of the failure mechanisms for Sn3.8Ag0.7Cu and Sn3.5Ag solder on organic solderability preservative (OSP) and electroless Ni immersion Au (ENIG) pad surface finishes are discussed. Interrupted fatigue test results were used to document the location and progression of damage.

Keywords

circuit reliability; copper alloys; crystal morphology; failure analysis; fatigue testing; printed circuit testing; silver alloys; soldering; solders; surface finishing; thermal stress cracking; tin alloys; ENIG; Ni-Au; OSP; SnAg; SnAg solder; SnAgCu; SnAgCu solder; complexity; damage evolution; damage location; damage progression; electroless Ni immersion Au pad surface finishes; failure mechanisms; intermetallic morphology; interrupted fatigue test; lead free solder interconnections; organic solderability preservative pad surface finishes; thermal fatigue failure; thermomechanical fatigue; Environmentally friendly manufacturing techniques; Fatigue; Gold; Intermetallic; Lead; Soldering; Surface finishing; Surface morphology; Thermomechanical processes; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1319418

Filename

1319418