DocumentCode :
416033
Title :
Fast active alignment in photonics device packaging
Author :
Guo, Jingyan ; Heyler, Randy
Author_Institution :
Newport Corp., Irvine, CA, USA
Volume :
1
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
813
Abstract :
Of the many areas that are being addressed to reduce packaging costs in photonics, the process of aligning and attaching fibers and micro-optical components in the package is still regarded as one of the most expensive and time consuming. This paper reports on recent work in significantly reducing the overall cycle time for active optical alignment, utilizing a combination of modified automation algorithms and upgraded firmware and software on existing automation tools. A novel "fast alignment" technology is introduced and cycle time reductions of between 60% and 80% are reported for several relevant applications, including direct coupling with a lensed fiber and indirect coupling with a ball lens and a fiber. The cycle time effects of coupling geometry, initial process set-up conditions, and other process parameter sensitivities are also discussed.
Keywords :
joining processes; microassembling; micropositioning; optical fibres; optoelectronic devices; semiconductor device packaging; assembly; ball lens indirect coupling; coupling geometry; fast active alignment; fiber alignment; fiber attachment; fully automated machine vision; lensed fiber direct coupling; optical alignment cycle time reduction; photonics device packaging; Automation; Costs; Joining processes; Microoptics; Microprogramming; Optical fiber devices; Optical sensors; Packaging; Photonics; Software algorithms;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
Type :
conf
DOI :
10.1109/ECTC.2004.1319430
Filename :
1319430
Link To Document :
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