DocumentCode
416039
Title
Packaging of disposable chips for bioanalytical applications [microfluidics]
Author
Schuenemann, Matthias ; Thomson, D. ; Atkins, Micah ; Garst, Sebastiaan ; Yussuf, Abdiraham ; Solomon, Matthew ; Hayes, Jason ; Harvey, Ewan
Author_Institution
CRC for Microtechnology & IRIS Ind. Res., Inst. of Swinburne, Hawthorn, Vic., Australia
Volume
1
fYear
2004
fDate
1-4 June 2004
Firstpage
853
Abstract
In this paper, the realization of microfluidic packages by bonding several stacked layers of microstructured polymer films in a reel-to-reel manufacturing system is shown to be a promising approach. The smart division between disposable and reusable system parts as well as the careful selection of materials, based on microstructuring, bonding, biocompatibility and auto fluorescence criteria may lead to bioanalytical devices with a very competitive cost of ownership per test. For the realization of such microfluidic disposables, microstructuring technologies based on UV laser micromachining, bonding technologies based on thermal diffusion, adhesives and microwave sealing using conductive polymers, and surface modification approaches for the reduction of non-specific protein binding are discussed.
Keywords
adhesives; biosensors; bonding processes; conducting polymers; fluorescence; laser beam machining; microfluidics; micromachining; microwave heating; packaging; polymer films; proteins; UV laser micromachining; adhesives; autofluorescence; bioanalytical disposable chip packaging; biocompatibility; bonding; conductive polymers; disposable system parts; microfluidic packages; microstructured polymer films; microstructuring technologies; microwave sealing; point-of-care diagnostic sensors; point-of-use diagnostic sensors; protein binding; reel-to-reel manufacturing system; reusable system parts; surface modification; thermal diffusion bonding; Biological materials; Bonding; Conducting materials; Fluorescence; Manufacturing systems; Microfluidics; Microwave technology; Optical materials; Packaging; Polymer films;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN
0-7803-8365-6
Type
conf
DOI
10.1109/ECTC.2004.1319437
Filename
1319437
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