DocumentCode :
416039
Title :
Packaging of disposable chips for bioanalytical applications [microfluidics]
Author :
Schuenemann, Matthias ; Thomson, D. ; Atkins, Micah ; Garst, Sebastiaan ; Yussuf, Abdiraham ; Solomon, Matthew ; Hayes, Jason ; Harvey, Ewan
Author_Institution :
CRC for Microtechnology & IRIS Ind. Res., Inst. of Swinburne, Hawthorn, Vic., Australia
Volume :
1
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
853
Abstract :
In this paper, the realization of microfluidic packages by bonding several stacked layers of microstructured polymer films in a reel-to-reel manufacturing system is shown to be a promising approach. The smart division between disposable and reusable system parts as well as the careful selection of materials, based on microstructuring, bonding, biocompatibility and auto fluorescence criteria may lead to bioanalytical devices with a very competitive cost of ownership per test. For the realization of such microfluidic disposables, microstructuring technologies based on UV laser micromachining, bonding technologies based on thermal diffusion, adhesives and microwave sealing using conductive polymers, and surface modification approaches for the reduction of non-specific protein binding are discussed.
Keywords :
adhesives; biosensors; bonding processes; conducting polymers; fluorescence; laser beam machining; microfluidics; micromachining; microwave heating; packaging; polymer films; proteins; UV laser micromachining; adhesives; autofluorescence; bioanalytical disposable chip packaging; biocompatibility; bonding; conductive polymers; disposable system parts; microfluidic packages; microstructured polymer films; microstructuring technologies; microwave sealing; point-of-care diagnostic sensors; point-of-use diagnostic sensors; protein binding; reel-to-reel manufacturing system; reusable system parts; surface modification; thermal diffusion bonding; Biological materials; Bonding; Conducting materials; Fluorescence; Manufacturing systems; Microfluidics; Microwave technology; Optical materials; Packaging; Polymer films;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
Type :
conf
DOI :
10.1109/ECTC.2004.1319437
Filename :
1319437
Link To Document :
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