Novel microstructuring technology for glass on silicon and glass-substrates

Author

Mund, Dietrich ; Leib, Jürgen

Author_Institution

SCHOTT Electron. Packaging GmbH, Landshut, Germany

Volume

1

fYear

2004

fDate

1-4 June 2004

Firstpage

939

Abstract

Micro structuring glass (MSG) technology is an exciting new technology, that has the potential for solving demands in microelectronic and microfluidic applications including hermetic wafer level packaging. MSG offers the following advantages; chemical resistant borosilicate glass layers, layered structuring with photo resist and high glass deposition rates at low temperatures.

Keywords

borosilicate glasses; hermetic seals; integrated circuit packaging; microfluidics; passivation; photolithography; photoresists; plasma CVD; MSG technology; PVD-PIAD; borosilicate glass layers; chemical resistance; glass on glass substrates; glass on silicon substrates; hermetic passivation; hermetic wafer level packaging; high glass deposition rates; layered structuring; low temperature deposition; mask-aligner lithography; microelectronics; microfluidics; microstructuring glass technology; photo resist; physical vapor deposition; plasma ion assisted deposition; Chemical technology; Glass; Leak detection; Nonhomogeneous media; Packaging; Plasma temperature; Resists; Silicon; Wafer bonding; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1319450

Filename

1319450