Title : 
Parallel optical interconnect at 10 Gb/s per channel
         
        
            Author : 
Simon, J. Onathan ; Windover, Lisa Buckman ; Rosenau, Steven ; Giboney, Kirk ; Law, Benjamin ; Flower, Graham ; Mirkarimi, Laura ; Grot, Annette ; Lin, Chao-Kun ; Tandon, Ashish ; Rankin, Glenn ; Gruhlke, Russell ; Dolfi, David
         
        
            Author_Institution : 
Agilent Labs., Agilent Technol. Inc., Palo Alto, CA, USA
         
        
        
        
        
        
            Abstract : 
In many high-end systems, there is a growing need to replace copper interconnects with optical interconnects for link lengths up to 600 meters. 12-channel parallel-optical interconnects with each channel operating at a data rate up to 10 Gb/s are designed, assembled, and demonstrated. This is achieved using bottom-emitting 990-nm VCSELs and bottom-illuminated photodetectors (PDs) flip-chip bonded directly to 12-channel transmitter and receiver integrated circuits, respectively. Results show a 12-channel parallel-optical transmitter module operating at a data rate of 10 Gb/s per channel with all 12 channels operating simultaneously. In addition, a 12-channel parallel-optical receiver module with each channel operating at a data rate up to 10 Gb/s with all channels operating simultaneously is demonstrated. A BER <10-12 is measured on a single channel operating at a data rate of 10 Gb/s with all 12 channels operating simultaneously after transmission over 100 meters of 50-μm core standard multimode ribbon fiber.
         
        
            Keywords : 
error statistics; flip-chip devices; optical fibre communication; optical interconnections; optical receivers; optical transmitters; photodetectors; surface emitting lasers; 10 Gbit/s; 100 m; 50 micron; 600 m; 990 nm; BER; bottom-emitting VCSEL; bottom-illuminated photodetectors; flip-chip bonding; link length; multimode ribbon fiber; parallel optical interconnect; receiver IC; receiver module; transmitter IC; transmitter module; Assembly systems; Bonding; Copper; Integrated circuit interconnections; Optical design; Optical interconnections; Optical receivers; Optical transmitters; Photodetectors; Vertical cavity surface emitting lasers;
         
        
        
        
            Conference_Titel : 
Electronic Components and Technology Conference, 2004. Proceedings. 54th
         
        
            Print_ISBN : 
0-7803-8365-6
         
        
        
            DOI : 
10.1109/ECTC.2004.1319464