Title :
Reliability-driven layout decompaction for electromigration failure avoidance in complex mixed-signal IC designs
Author :
Jerke, Goran ; Lienig, Jens ; Scheible, Jurgen
Author_Institution :
Robert Bosch GmbH, Germany
Keywords :
Algorithm design and analysis; Automotive electronics; Conducting materials; Current density; Electromigration; Integrated circuit interconnections; Integrated circuit layout; Integrated circuit reliability; Routing; Signal design;
Conference_Titel :
Design Automation Conference, 2004. Proceedings. 41st
Conference_Location :
San Diego, CA, USA
Print_ISBN :
1-51183-828-8