DocumentCode
416270
Title
Variational delay metrics for interconnect timing analysis
Author
Agarwal, K. ; Sylvester, D. ; Blaauw, D. ; Liu, F. ; Nassif, S. ; Vrudhula, S.
Author_Institution
University of Michigan, Ann Arbor
fYear
2004
fDate
7-11 July 2004
Firstpage
381
Lastpage
384
Abstract
In this paper we develop an approach to model interconnect delay under process variability for timing analysis and physical design optimization. The technique allows for closed-form computation of interconnect delay probability density functions (PDFs) given variations in relevant process parameters such as linewidth, metal thickness, and dielectric thickness. We express the resistance and capacitance of a line as a linear function of random variables and then use these to compute circuit moments. Finally, these variability-aware moments are used in known closedform delay metrics to compute interconnect delay PDFs. We compare the approach to SPICE based Monte Carlo simulations and report an error in mean and standard deviation of delay of 1% and 4% on average, respectively.
Keywords
Capacitance; Delay; Design optimization; Dielectrics; Integrated circuit interconnections; Performance analysis; Probability density function; Random variables; SPICE; Timing;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2004. Proceedings. 41st
Conference_Location
San Diego, CA, USA
ISSN
0738-100X
Print_ISBN
1-51183-828-8
Type
conf
Filename
1322508
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