• DocumentCode
    416270
  • Title

    Variational delay metrics for interconnect timing analysis

  • Author

    Agarwal, K. ; Sylvester, D. ; Blaauw, D. ; Liu, F. ; Nassif, S. ; Vrudhula, S.

  • Author_Institution
    University of Michigan, Ann Arbor
  • fYear
    2004
  • fDate
    7-11 July 2004
  • Firstpage
    381
  • Lastpage
    384
  • Abstract
    In this paper we develop an approach to model interconnect delay under process variability for timing analysis and physical design optimization. The technique allows for closed-form computation of interconnect delay probability density functions (PDFs) given variations in relevant process parameters such as linewidth, metal thickness, and dielectric thickness. We express the resistance and capacitance of a line as a linear function of random variables and then use these to compute circuit moments. Finally, these variability-aware moments are used in known closedform delay metrics to compute interconnect delay PDFs. We compare the approach to SPICE based Monte Carlo simulations and report an error in mean and standard deviation of delay of 1% and 4% on average, respectively.
  • Keywords
    Capacitance; Delay; Design optimization; Dielectrics; Integrated circuit interconnections; Performance analysis; Probability density function; Random variables; SPICE; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2004. Proceedings. 41st
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    0738-100X
  • Print_ISBN
    1-51183-828-8
  • Type

    conf

  • Filename
    1322508